SMD line 2
The solid placement system SIPLACE S25 / F5HM combines flexibility with accuracy. A Collect & Place process using three different placement heads is used for placement.
The printed circuit board to be assembled is not moved, which has decisive advantages in terms of assembly accuracy.
More details
the SMD-2 line
Board handling
- ASYS throughout
Paste printing
- EKRA X5 Professional with 2½ D
- Paste inspection
- Stencil underside inspection
- Stencil cleaning system
- Alignment accuracy: ± 12.5 µm @ 6 sigma
Placement machines
- Siplace 80 S20
- Siplace 80 S23
- Siplace 80 F5
- Placement performance approx. 20,000 cph
Reflow oven
- SMT Quattro Peak L Plus (length 6265mm)
AOI
- Viscom S 3088 III with 8 cameras inline with repair ejection and good / bad sorting as a separate line
Stencil cleaning machine
- Kolb PS 31
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