SMD line 1
Absolute precision, maximum placement performance – top performance in these two disciplines make our SIPLACE X placement platform the first choice for demanding high-volume applications.
The SIPLACE X is used successfully wherever the highest placement performance, the lowest ppm rates, uninterrupted set-up changes, fast product launches (NPI) and the production-ready placement of ultra-small components of the latest generation (01005 (metric)) are required.
More details of the SMD-1 line
Board handling
- ASYS throughout
Paste printing
- EKRA X5 Professional with 2½ D paste inspection
- Stencil underside inspection
- Stencil cleaning system
- Alignment accuracy: ± 12.5 µm @ 6 sigma
Placement machines
- Siemens X4 with 4 SIPLACE high-performance CPP (12-fold) placement heads, placement performance: IPC value 82,000 cph
- Siemens X3 with 2 SIPLACE high-performance CPP (12-way) placement heads, one of them with a camera for pick and place applications and a TwinHead head , placement performance: IPC value 62,700 cph Component range 01005 up to 200 × 125 mm that can be fitted
Reflow oven
- SMT Quattro Peak L Plus (length 6265mm)
AOI
- The iS6059 AOI system from Viscom meets the requirements of the most modern and economical electronics production.
The system is based on Viscom’s unique 3D AOI technology and combines precise defect detection with high inspection speed.
Stencil cleaning machine
- Kolb PS 31
Do you have any questions about your planned products? Feel free to contact us and tell us about your ideas. We would be happy to support you!
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